The field of computational fluid dynamics is a subfield of fluid mechanics which employs algorithms as well as a data structure to study and resolve problems involving fluid flow
Electrothermal co-simulation is used as part of CFD modeling and simulation, as well as a comparison of the different types of solvers used in these simulations. You can also click on the following source/link to know more about CFD simulation or software for thermal: Engineering and software for thermal, mechanical and fluid simulation CFD – Simulations and Projects
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Process flow for CFD modeling and simulation
The simulation flow only works when you define heat sources in your board. This is done through the electrical conduction analysis and heat conduction analysis steps, which relate the thermal conductivity of your components to current density and heat generation.
The overall process flow for CFD modeling and simulation can be broken down into the steps shown below. This type of modeling occurs after you create your PCB layout and have imported verified component models into your board for simulations.
1. Determine heat sources into the system using power dissipation in components (including passives and semiconductor dies).
2. Model heat conduction from the package into the surrounding PCB.
3. Model heat transfer away from hot regions and into cold regions via airflow.
Note that the temperature dependence of power output and other electrical characteristics has not been considered in this simulation flowchart. This would create a new feedback loop between the CFD portion of the simulation and the definition of heat sources.